Job Location

Israel, Hod HaSharon (Hybrid)

Job Brief

Drive fault isolation and root cause analysis of advanced semiconductor devices, with a focus on memory arrays and associated logic and peripheral circuitry.

Job Description

• Lead fault isolation and root cause analysis of memory and logic failures, including electrical, test, and yield failures, from initial failure signature through physical confirmation
• Analyze failures at device, memory-cell, array, and circuit level, differentiating between design, test, device, process, and physical failure mechanisms
• Correlate electrical characterization, memory-test and yield results, schematics, layout, and physical FA findings to identify and validate root cause
• Develop and execute effective fault-isolation strategies, localizing failures down to the relevant cell, circuit, interconnect, or physical structure
• Work closely with Design, Device, Test/Product, Process, Reliability, and Physical FA labs to solve complex failures and drive corrective actions
• Improve FA methodologies, prepare and present engineering FA report on complex failure investigations

Required Skills and Experience

• Sc. or M.Sc. in Electrical Engineering, Physics, Materials Engineering, or a related technical field
• 5+ years of relevant experience in semiconductor failure analysis, fault isolation, silicon debug, memory characterization, product engineering, or a related field
• Strong experience in fault isolation and root cause analysis of semiconductor devices
• Ability to analyze electrical, test, and yield failure signatures and correlate them with schematics, layout, circuit behavior, and physical findings
• Strong analytical and problem-solving skills, with the ability to drive complex investigations across multiple engineering disciplines

Nice to have:

• Understanding memory architecture and digital/analog circuitry
• Experience with non-volatile memory or advanced memory technologies such as Flash, MRAM, PCM, ReRAM, or similar technologies
• Experience with memory tests, ATE, electrical characterization, yield analysis, and memory fault analysis
• Familiarity with advanced fault-isolation and physical FA techniques, such as EMMI, OBIRCH, LIVA/TIVA, laser-based techniques, nanoprobing, SEM, FIB, or TEM