IC Package Layout Engineer

Mobileye · Jerusalem · Posted 2026-10-08

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Mobileye develops purpose-built hardware and AI technologies that power advanced driver-assistance and autonomous-driving solutions. Our EyeQ™ SoCs and imaging radar technologies are designed to deliver scalable, automotive-grade performance and help enable safer mobility worldwide.

Join our advanced packaging team and take ownership of package-substrate layout for cutting-edge digital and RF products. You will collaborate with silicon, package, SI/PI, PCB, manufacturing, and OSAT teams to deliver high-quality, manufacturable package layouts that meet demanding automotive requirements

What will your job look like:

    • Own IC package-substrate layout from feasibility through manufacturing release.
    • Perform die placement, bump fan-out, ball-map planning, package-size estimation, and layer planning.
    • Set up stack-ups, padstacks, design rules, and layout constraints.
    • Implement high-density bump-to-ball routing for signal, power, and ground nets.
    • Route high-speed and RF interfaces according to defined SI/PI constraints.
    • Perform DRC, connectivity, LVS/netlist, and DFM checks.
    • Generate artwork, fabrication drawings, reports, and release documentation.
    • Resolve layout-related queries from substrate manufacturers and OSATs.

All you need is:

    • B.Sc. in Electrical Engineering or a related field, or equivalent practical experience.
    • 5+ years of hands-on IC package-substrate layout experience.
    • Strong proficiency with Cadence Allegro Package Designer.
    • Experience with flip-chip BGA, bump fan-out, ball-map optimization, and multilayer substrate routing.
    • Experience working from schematics, netlists, design rules, and constraint documents.
    • Good understanding of high-speed layout principles, including differential pairs, length matching, spacing, and return paths.
    • Good understanding of power-delivery and power-integrity layout principles, including power and ground plane design, current-carrying requirements, and via-array implementation.
    • Experience with DRC, connectivity verification, DFM, and manufacturing-data release.
    • Strong attention to detail and the ability to independently own designs through release.

Nice to have:

    • Experience with RF, SiP, multi-die, interposer, or 2.5D package layouts.
    • Experience with DDR, PCIe, SerDes, MIPI, or UFS interfaces.
    • Experience with Siemens Xpedition Package Designer or CAM350.
    • Experience working directly with substrate manufacturers and OSATs.
    • Experience with scripting for package-layout automation.
Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!